HKMA launches Digital Bond Grant Scheme

The Hong Kong Monetary Authority (HKMA) launched the Digital Bond Grant Scheme (DBGS) on November 28, 2024, as announced in the 2024 Policy Address. The DBGS aims to foster the digital securities market and promote tokenization in capital markets by offering grants of up to HK$2.5 million for eligible digital bond issuances in Hong Kong. Details are outlined in the Guideline on the Digital Bond Grant Scheme, with applications open for an initial three-year period.

Resources: https://www.hkma.gov.hk/eng/news-and-media/press-releases/2024/11/20241128-3/